Suwon, South Korea

Hyunjoo Jeon

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hyunjoo Jeon. Retrieved from https://idiyas.com/inventor/hyunjoo-jeon-i3i8a6e4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hyunjoo Jeon and an Electrostatic Chuck Invention.

Introduction

Hyunjoo Jeon is an inventor based in Suwon, South Korea, and is associated with Samsung Electronics Co., Ltd. Her patent work includes an electrostatic chuck designed with structural features intended to support the ceramic puck and seal its edge.

Latest Patents

Jeon is named on 1 patent, titled “Electrostatic Chuck.” The invention describes a chuck body with a radially protruding step, an adhesive layer, and a ceramic puck whose edge extends beyond the body’s upper surface. A sealing member sits beneath the puck’s edge and contacts an inclined surface on an installation portion of the chuck body.

Career Highlights

Jeon’s recorded patent activity reflects work on electrostatic chuck design, a component used in semiconductor manufacturing equipment. Her association with Samsung Electronics connects this invention to a company active in electronics and semiconductor technologies.

Collaborations

The available information associates Jeon’s patent with Samsung Electronics Co., Ltd. It does not identify additional inventors or collaborators for the invention.

Conclusion

Hyunjoo Jeon’s patent documents a specific electrostatic chuck design that combines a ceramic puck, adhesive layer, and sealing structure, highlighting her contribution to semiconductor equipment innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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