This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Hyungku Kim - Innovator in Semiconductor Technology
Introduction
Hyungku Kim is an inventor based in Suwon-si, South Korea. He is known for his contributions to the field of semiconductor technology. Although he currently holds no granted patents, his innovative ideas are reflected in his patent applications.
Latest Patent Applications
One of his notable patent applications is titled "SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME." This application describes a substrate bonding apparatus that includes a first bonding chuck with a first base and a first transformation plate. The second bonding chuck features a second base that faces the first bonding chuck. The first base is designed with a recess groove that is recessed inward from the surface where the first transformation plate is mounted. The first transformation plate has a first protrusion that extends outward from its first surface. The second surface of the first transformation plate is configured to support a first substrate, and it is mounted on the first base in a way that allows the distance between the first transformation plate and the first base to vary.
Conclusion
Hyungku Kim's work in semiconductor technology showcases his innovative approach to substrate bonding apparatuses. His contributions, although not yet reflected in granted patents, highlight the potential for future advancements in the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile