This inventor holds 2 USPTO granted patents and 5 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Hyungchul Shin - Innovator in Semiconductor Packaging
Introduction
Hyungchul Shin is an inventor based in Suwon-si, South Korea. He is known for his work in the field of semiconductor packaging. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
Hyungchul Shin has submitted several notable patent applications. One of his applications is for a semiconductor package that includes stacked semiconductor chips. This design features semiconductor chips with substrates that have front and rear surfaces, interlayer dielectric layers, and protection layers. The upper conductive pads of one semiconductor chip are in contact with the lower conductive pads of an adjacent chip, showcasing a unique approach to semiconductor design.
Another application focuses on a semiconductor package that includes a lower semiconductor chip and a first semiconductor chip. This design incorporates a through-electrode that vertically penetrates the semiconductor substrate, along with upper and lower pads that are integrally formed. The innovative structure aims to enhance the functionality and efficiency of semiconductor packages.
Conclusion
Hyungchul Shin's contributions to semiconductor packaging demonstrate his commitment to innovation in the field. His latest patent applications reflect a forward-thinking approach that could influence future developments in semiconductor technology.