Hyung-sun Jang

Title: The Innovative Contributions of Hyung-sun Jang in Semiconductor Technology

Introduction

Hyung-sun Jang, an accomplished inventor based in Hwasung, South Korea, has made significant strides in the field of semiconductor technology. He is known for his innovative patent that introduces a novel method for wafer level packaging, showcasing his expertise and contribution to advancements in this domain.

Latest Patents

Hyung-sun Jang holds a patent titled "Method for Wafer Level Package and Semiconductor Device Fabricated Using the Same." This patent describes a packaging methodology involving a substrate with multiple chips, where an adhesive layer is formed corresponding to the boundaries of the chips. A cover plate with an opening is then attached to expose either the adhesive layer or the substrate, facilitating improved packaging for semiconductor devices.

Career Highlights

Jang's career is marked by his association with Samsung Electronics Co., Ltd., one of the leading technology companies globally. His work at Samsung reflects his commitment to innovation in semiconductor research and development. With a focus on efficient packaging solutions, he has positioned himself as a valuable asset to his organization.

Collaborations

Throughout his career, Hyung-sun Jang has collaborated with talented individuals such as JiSun Hong and Taeje Cho. These collaborations highlight his ability to work within a team environment, optimizing research efforts and driving forward semiconductor technologies.

Conclusion

Hyung-sun Jang stands out as a key figure in the realm of semiconductor innovations. His patented method for wafer level packaging not only emphasizes his inventive spirit but also represents a significant technological advancement for Samsung Electronics Co., Ltd. As advancements in the semiconductor industry continue, Jang's contributions will undoubtedly play a crucial role in shaping future technologies.