The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Jan. 21, 2011
Jisun Hong, Hwasung, KR;
Taeje Cho, Hwasung, KR;
Un-byoung Kang, Hwasung, KR;
Hyuekjae Lee, Hwasung, KR;
Youngbok Kim, Hwasung, KR;
Hyung-sun Jang, Hwasung, KR;
JiSun Hong, Hwasung, KR;
Taeje Cho, Hwasung, KR;
Un-Byoung Kang, Hwasung, KR;
Hyuekjae Lee, Hwasung, KR;
Youngbok Kim, Hwasung, KR;
Hyung-sun Jang, Hwasung, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
Provided is a wafer level packaging method and a semiconductor device fabricated using the same. In the method, a substrate comprising a plurality of chips is provided. An adhesive layer is formed on the substrate corresponding to boundaries of the plurality of chips. A cover plate covering an upper portion of the substrate and having at least one opening exposing the adhesive layer or the substrate at the boundaries among the plurality of chips is attached to the adhesive layer.