Yongin, South Korea

Hyung-sik Hong


Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 18(Granted Patents)


Location History:

  • Kyungki-do, KR (2000)
  • Yongin, KR (2003 - 2005)

Company Filing History:


Years Active: 2000-2005

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3 patents (USPTO):Explore Patents

Title: Innovations of Hyung-sik Hong

Introduction

Hyung-sik Hong is a notable inventor based in Yongin, South Korea. He has made significant contributions to the field of chemical mechanical polishing (CMP) apparatuses. With a total of 3 patents, his work focuses on enhancing the efficiency and cleanliness of wafer processing.

Latest Patents

One of his latest patents is a pedestal of a load-cup which supports wafers loaded and unloaded onto and from a chemical mechanical polishing apparatus. This innovative pedestal includes a pedestal plate and a pedestal film that extends over a limited area at the upper surface of the pedestal plate. The design incorporates regions directly around the fluid ports for vacuum-chucking the wafers and spraying deionized water. The cross-shaped part of the pedestal plate bears the fluid ports, while the pedestal film may consist of annular members extending around each fluid port or members extending radially around several ports. This limited contact area reduces the amount of contaminants that could be transferred to the wafer surface.

Career Highlights

Hyung-sik Hong is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in the field of semiconductor manufacturing. His work has been instrumental in improving the processes involved in wafer handling and processing.

Collaborations

He has collaborated with notable coworkers such as Yun-sik Yang and Kyung-dae Kim, contributing to advancements in their shared field of expertise.

Conclusion

Hyung-sik Hong's contributions to the semiconductor industry through his innovative patents demonstrate his commitment to enhancing wafer processing technologies. His work at Samsung Electronics Co., Ltd. continues to influence the future of chemical mechanical polishing apparatuses.

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