Samsung Electronics Co., Ltd.

Hyung-sik Hong

Min-gyu Kim

Yun-sik Yang

Kyung-dae Kim

Sung-soo An

A pedestal of a load-cup for supporting wafers loaded onto and being unloaded from a chemical mechanical polishing (CMP) apparatus includes a pedestal plate, and a pedestal film which extends over only a limited area at the upper surface of the pedestal plate. This area includes the regions directly around the fluid ports provided in the pedestal plate for vacuum-chucking the wafers and spraying deionized water. The pedestal plate may have a cross-shaped part, the entirety of which bears the fluid ports. The pedestal film may include annular members each extending around only a respective one of the fluid ports, or one or more members each extending radially around several of the fluid ports. By offering a rather limited contact area to the wafer supported on the pedestal, the pedestal film reduces the amount of contaminants which could be transferred to the wafer surface in contact therewith.

Pedestal of a load-cup which supports wafers loaded/unloaded onto/from a chemical mechanical polishing apparatus

A wafer aligning apparatus for semiconductor device fabrication includes a cassette support on which is mounted a cassette holding wafers immersed in a non-conducting fluid. A guide roller is composed of carbon fiber reinforced polyether and rotates in contact with circumferential edges of the wafers. A wafer support holds the wafers apart from the roller when flat zones of the wafers are aligned with the wafer support

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Yongin, South Korea

Hyung-sik Hong