Yongin, South Korea

Hyung Dong Kang


Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 18(Granted Patents)


Location History:

  • Gyunggi-Do, KR (2009)
  • Yongin, KR (2010)

Company Filing History:


Years Active: 2009-2010

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2 patents (USPTO):Explore Patents

Title: Innovations by Hyung Dong Kang

Introduction

Hyung Dong Kang is a notable inventor based in Yongin, South Korea. He has made significant contributions to the field of electronics, particularly in the manufacturing of printed circuit boards (PCBs) with embedded capacitors. With a total of 2 patents, his work has garnered attention in the industry.

Latest Patents

Hyung Dong Kang's latest patents include a method for manufacturing a capacitor embedded in a PCB. This method involves preparing a copper clad lamination (CCL) substrate with a reinforcement member and copper foils on both surfaces. The process includes planarizing the surfaces of the copper foils, forming a dielectric layer, and creating a top electrode on the dielectric layer. Another significant patent is for a method of manufacturing a printed circuit board with a thin film capacitor embedded therein. This method utilizes sputtering techniques to form lower and upper electrodes, along with a dielectric layer, and involves the creation of via holes for electrical connections.

Career Highlights

Hyung Dong Kang is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate in the field of electronics. His work has been instrumental in advancing PCB technology, making it more efficient and effective for various applications.

Collaborations

He has collaborated with notable coworkers, including Yul Kyo Chung and Seung Eun Lee, contributing to the development of cutting-edge technologies in their field.

Conclusion

Hyung Dong Kang's contributions to the field of electronics through his innovative patents and work at Samsung Electro-Mechanics Co., Ltd. highlight his role as a key inventor in advancing PCB technology. His efforts continue to shape the future of electronic manufacturing.

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