The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2010
Filed:
Apr. 05, 2007
Applicants:
Seung Eun Lee, Seongnam, KR;
Yul Kyo Chung, Yongin, KR;
Hyung Dong Kang, Yongin, KR;
Hyun Ju Jin, Seoul, KR;
Inventors:
Seung Eun Lee, Seongnam, KR;
Yul Kyo Chung, Yongin, KR;
Hyung Dong Kang, Yongin, KR;
Hyun Ju Jin, Seoul, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8242 (2006.01); H01G 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing a capacitor embedded in a PCB includes: preparing a copper clad lamination (CCL) substrate having a reinforcement member and copper foils formed on both surfaces of the reinforcement member; planarizing surfaces of the copper foils of the CCL substrate; forming a dielectric layer on the planarized surface of the copper foils; and forming a top electrode on the dielectric layer.