This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Hyundong Lee - Innovator in Semiconductor Packaging
Introduction
Hyundong Lee is a prominent inventor based in Cheonan, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise and innovative spirit. His work has led to the development of a unique semiconductor package that enhances the functionality and efficiency of electronic devices.
Latest Patents
Hyundong Lee holds a patent for a semiconductor package. This innovative design includes a first redistribution structure with multiple first redistribution layers and vias. A semiconductor chip is positioned on this structure, featuring a chip pad. The design incorporates a connection pad that links the semiconductor chip to the first redistribution structure, along with a connection bump that connects the connection pad to the chip pad. Additionally, a molding layer surrounds the first redistribution structure and the semiconductor chip, while a through electrode extends through the molding layer. A wetting layer is also present between the first redistribution structure and the molding layer. This patent highlights Lee's commitment to advancing semiconductor technology.
Career Highlights
Hyundong Lee is currently employed at Samsung Electronics Ltd., a leading global technology company. His role at Samsung allows him to work on cutting-edge projects that push the boundaries of semiconductor technology. His contributions have been instrumental in enhancing the performance and reliability of electronic components.
Collaborations
Hyundong Lee collaborates with talented professionals in his field, including his coworker Jihye Shin. Together, they work on innovative projects that aim to improve semiconductor packaging solutions.
Conclusion
Hyundong Lee is a notable inventor whose work in semiconductor packaging has made a significant impact in the technology sector. His innovative designs and patents reflect his dedication to advancing the field. His contributions at Samsung Electronics Ltd. continue to shape the future of electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile