Cheonan, South Korea

Hyun Woo Lee

This inventor holds 2 USPTO granted patents. Top assignee: Hana Micron Inc.. Active years: 2014-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hyun Woo Lee. Retrieved from https://idiyas.com/inventor/hyun-woo-lee-3rnh9brp

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 50.0

Average Co-Inventor Count = 2.7

ph-index = 1

Forward Citations = 8(Granted Patents)


Location History:

  • Cheonan-si, KR (2014)
  • Chungcheongnam-do, KR (2020)

Company Filing History:


Years Active: 2014-2020

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2 patents (USPTO):Explore Patents

Title: Innovations by Hyun Woo Lee

Introduction

Hyun Woo Lee is a notable inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is the "Metal core solder ball interconnector fan-out wafer level package." This invention includes a redistribution layer and a semiconductor chip that is electrically connected through a bump. A protective member safeguards the semiconductor chip, with a portion removed to expose the upper surface for heat dissipation and to prevent warpage. The interconnector, positioned outside the semiconductor chip, features a metal core solder ball composed of copper, nickel, and silver.

Another significant patent is the "Stacked semiconductor package." This invention comprises a substrate unit that connects a first substrate with a contact pad to a second substrate with a contact pad. It includes a first chip laminate with multiple stacked semiconductor chips and a second chip laminate with additional stacked chips. The design incorporates conductive wires that connect bonding pads of the semiconductor chips to their respective contact pads, along with a bonding unit that vertically stacks and bonds the chip laminates.

Career Highlights

Hyun Woo Lee is currently employed at Hana Micron Inc., where he continues to develop innovative semiconductor solutions. His work has contributed to advancements in packaging technology, enhancing the performance and reliability of semiconductor devices.

Collaborations

He collaborates with talented coworkers, including Chul Kyu Hwang and Jin Wook Jeong, who share his commitment to innovation in the semiconductor industry.

Conclusion

Hyun Woo Lee's contributions to semiconductor technology through his patents reflect his dedication to innovation and excellence. His work at Hana Micron Inc. continues to influence the field, paving the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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