Hyun Koock Shin

Title: Hyun Koock Shin: Innovator in Vapor Deposition Technology

Introduction

Hyun Koock Shin is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of materials science, particularly in the area of vapor deposition technology. His innovative methods have the potential to advance various applications in electronics and materials engineering.

Latest Patents

Hyun Koock Shin holds a patent for a "Method for thin film vapor deposition of a dialkyl amido dihydroaluminum compound." This method provides a novel approach for the vapor deposition of aluminum films. The technique utilizes a dialkyl amido dihydroaluminum compound of the formula [HAlNRR], where R represents alkyl groups with 1 to 3 carbons, and n is an integer of 2 or 3. The resulting aluminum films can vary in thickness and may consist of pure aluminum or mixed metal films. Both Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) methods can be employed in this innovative process.

Career Highlights

Hyun Koock Shin is currently associated with Up Chemical Co., Ltd., where he continues to develop and refine his patented technologies. His work has positioned him as a key figure in the advancement of vapor deposition methods, contributing to the growth of the industry.

Collaborations

He collaborates with talented colleagues, including Bum Soo Kim and Jin Sik Kim, who share his passion for innovation and research in the field of materials science.

Conclusion

Hyun Koock Shin's contributions to vapor deposition technology exemplify the spirit of innovation in the materials science sector. His patented methods are paving the way for advancements in various applications, showcasing the importance of research and development in this field.