Hyun Jung Lee

Title: Innovator Spotlight: Hyun Jung Lee

Introduction

Hyun Jung Lee is a prominent inventor based in Aliso Viejo, California. With a strong focus on semiconductor technology, he has contributed significantly to the field through his innovative patents. His work at Conexant Systems, Inc. highlights his commitment to advancing technology and enhancing security in semiconductor packaging.

Latest Patents

Hyun Jung Lee holds two patents that showcase his inventive prowess. The first patent, titled "Semiconductor packages with reduced solder voiding," describes an advanced semiconductor package design. This package features a leadframe equipped with an I/O pad and a thermal pad. The fabricated semiconductor die, which includes a bond pad, is mounted onto the thermal pad's top surface. A wire bond connects the bond pad to the I/O pad, while the thermal pad has channels on its bottom surface. This design aims to minimize solder voids, enhancing the reliability of semiconductor devices.

The second patent, "Systems and methods of tamper-proof packaging of a semiconductor device," introduces a barrier layer that can be integrated into semiconductor packages. This layer serves as a defense against tampering attempts by malicious agents seeking access to sensitive information. If the device is physically tampered with, the barrier can render the sensitive device inoperable. Additionally, this protective packaging offers resistance against x-ray and thermal probing, as well as various chemical and electrical tampering threats.

Career Highlights

Hyun Jung Lee's career is marked by his tenure at Conexant Systems, Inc., where he has applied his expertise in semiconductor innovation. His dedication to developing advanced packaging solutions has positioned him as a valuable asset to his company and the broader tech community.

Collaborations

Throughout his career, Hyun Jung Lee has collaborated with notable colleagues, including Robert W. Warren and Nic Rossi. These partnerships have facilitated innovative research and the development of cutting-edge semiconductor technologies, further solidifying their collective impact within the industry.

Conclusion

Hyun Jung Lee’s contributions to the field of semiconductor packaging through his patents reflect his innovative spirit and commitment to excellence. As he continues his work at Conexant Systems, Inc., his inventions will likely shape the future of semiconductor technology, ensuring enhanced security and reliability in an increasingly digital world.