Hyun Jun Lee

Title: Hyun Jun Lee: Innovator in Printed Circuit Board Technology

Introduction

Hyun Jun Lee is a prominent inventor based in Suwon, South Korea. He has made significant contributions to the field of printed circuit board technology, holding a total of 2 patents. His work focuses on developing advanced materials that enhance the performance and reliability of electronic components.

Latest Patents

Hyun Jun Lee's latest patents include a resin composition for printed circuit boards, insulating films, prepregs, and multilayer printed circuit boards. The first patent discloses a resin composition that incorporates a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent with five or more functional groups. This innovative composition results in materials with a low coefficient of thermal expansion, excellent heat resistance, and a high glass transition temperature. The second patent details an epoxy resin composition that also includes a liquid crystal oligomer, an amino triazine novolac hardener, and an inorganic filler, further enhancing the performance of printed circuit boards.

Career Highlights

Hyun Jun Lee is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to push the boundaries of technology in the electronics industry. His expertise in resin compositions and insulating materials has positioned him as a key player in the development of next-generation printed circuit boards.

Collaborations

Throughout his career, Hyun Jun Lee has collaborated with notable colleagues, including Jin Seok Moon and Keun Yong Lee. These partnerships have fostered innovation and contributed to the advancement of technology in their field.

Conclusion

Hyun Jun Lee's contributions to printed circuit board technology exemplify his commitment to innovation and excellence. His patents reflect a deep understanding of material science and its application in electronics, making him a valuable asset to the industry.