This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Hyun Jong Moon: Semiconductor Package Inventor.
Introduction
Hyun Jong Moon is an inventor associated with Suwon, South Korea, and Samsung Electronics Co., Ltd. His listed work focuses on semiconductor packaging technology.
Latest Patents
Moon is credited with 1 patent, titled “Semiconductor package.” The invention describes a package with a die paddle, leads positioned on opposite sides, a spacer, and a semiconductor die mounted on the spacer. A wire connects the die to a lead, while a mold film covers the package components. The spacer is wider than the die paddle, allowing it to overlap a lead.
Career Highlights
Moon’s listed patent reflects work on semiconductor package structure, including the arrangement of the spacer, die paddle, and leads.
Collaborations
His listed coworkers include Jae Hyun Lim and Sung Woo Park.
Conclusion
Hyun Jong Moon’s recorded invention concerns a semiconductor package design and is associated with his work at Samsung Electronics Co., Ltd.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile