Suwon-si, South Korea

Hyun Chul Jung

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2020-2023

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3 patents (USPTO):Explore Patents

Title: The Innovations of Hyun Chul Jung

Introduction

Hyun Chul Jung is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding three patents to his name. His work is primarily associated with Samsung Electronics Co., Ltd., where he has been instrumental in advancing semiconductor packaging solutions.

Latest Patents

Hyun Chul Jung's latest patents focus on semiconductor package substrates and methods of manufacturing semiconductor packages. One of his notable inventions includes a semiconductor package substrate that features a semiconductor chip with a connection pad. This substrate is encapsulated with an encapsulant, which protects the semiconductor chip. Additionally, a connection member is placed on the semiconductor chip and the encapsulant, which includes a redistribution layer that is electrically connected to the connection pad. The design also incorporates a first passivation layer and an adhesive layer, enhancing the overall functionality and reliability of the semiconductor package.

Career Highlights

Throughout his career, Hyun Chul Jung has demonstrated a commitment to innovation in semiconductor technology. His work at Samsung Electronics Co., Ltd. has positioned him as a key player in the development of advanced semiconductor packaging solutions. His patents reflect his expertise and dedication to improving the efficiency and performance of semiconductor devices.

Collaborations

Hyun Chul Jung has collaborated with notable colleagues such as Tae Ho Ko and Dae Hee Lee. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas within the semiconductor field.

Conclusion

Hyun Chul Jung's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to shape the future of semiconductor packaging, making significant strides in technology advancement.

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