The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Jun. 08, 2018
Samsung Electronics Co., Ltd., Suwon-si, KR;
Chang Bo Lee, Suwon-Si, KR;
Joon Seok Oh, Suwon-Si, KR;
Hyun Chul Jung, Suwon-Si, KR;
Jeong Ho Yeo, Suwon-Si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A fan-out semiconductor package includes a first connection member having a through-hole first and second semiconductor chips disposed in the through-hole, an encapsulant encapsulating the first and second semiconductor chips, a second connection member disposed on at least one side of the first and second semiconductor chips and including a redistribution layer electrically connected to the first and second semiconductor chips, and an insulating via in which at least a portion of the first connection member is removed in a thickness direction and is filled with an insulating material.