Gyeonggi-do, South Korea

Hyuk Soo Moon


Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 7(Granted Patents)


Location History:

  • Yongin-si, KR (2006)
  • Gyeonggi-do, KR (2008 - 2012)

Company Filing History:


Years Active: 2006-2012

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4 patents (USPTO):Explore Patents

Title: Hyuk Soo Moon: Innovator in Semiconductor Packaging

Introduction

Hyuk Soo Moon is a prominent inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of four patents. His innovative work focuses on improving the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

One of Hyuk Soo Moon's latest patents is titled "Dicing film having shrinkage release film and method for manufacturing semiconductor package using the same." This invention relates to a dicing film that incorporates an adhesive film for dicing a wafer and a die adhesive film, which are essential for manufacturing semiconductor packages. The dicing film features a shrinkage release film inserted between the adhesive film and the die adhesive film. This design allows for easier separation of the die adhesive film and the die from the adhesive film during the process of picking up a semiconductor die. This innovation enhances the overall efficiency of semiconductor package manufacturing.

Career Highlights

Throughout his career, Hyuk Soo Moon has worked with notable companies such as LG Innotek Co., Ltd. and LG Cable Ltd. His experience in these organizations has contributed to his expertise in semiconductor technologies and innovations.

Collaborations

Hyuk Soo Moon has collaborated with several professionals in his field, including Joon Mo Seo and Cheol Jong Han. These collaborations have likely fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Hyuk Soo Moon is a distinguished inventor whose work in semiconductor packaging has led to significant advancements in the industry. His innovative patents and collaborations reflect his commitment to enhancing manufacturing processes. His contributions continue to shape the future of semiconductor technology.

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