The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Dec. 10, 2004
Joon MO Seo, Seoul, KR;
Hyuk Soo Moon, Gyeonggi-do, KR;
Cheol Jong Han, Gyeonggi-do, KR;
Jong Geol Lee, Gyeonggi-do, KR;
Kyung Tae WI, Seoul, KR;
Joon Mo Seo, Seoul, KR;
Hyuk Soo Moon, Gyeonggi-do, KR;
Cheol Jong Han, Gyeonggi-do, KR;
Jong Geol Lee, Gyeonggi-do, KR;
Kyung Tae Wi, Seoul, KR;
LG Innotek Co., Ltd., Seoul, KR;
Abstract
The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.