Suwon-si, South Korea

Hyuk Park

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electro-Mechanics. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hyuk Park. Retrieved from https://idiyas.com/inventor/hyuk-park-96crbhzu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hyuk Park and Printed Circuit Board Innovation.

Introduction

Hyuk Park is an inventor based in Suwon-si, South Korea. His patent work includes a printed circuit board design focused on the arrangement and protection of metal pads and electronic components.

Latest Patents

Park is associated with 1 patent, titled “Printed Circuit Board.” The invention describes a circuit board with an electronic component that has a body and multiple spaced metal pads. A passivation layer covers portions of the pads and includes openings that expose different pad areas, as well as separate openings spaced away from the pads. An insulating layer extends into at least part of these openings and covers at least part of the electronic component.

Career Highlights

Park is associated with Samsung Electro-Mechanics. His patent reflects work on printed circuit board structures and the placement of insulating and passivation layers.

Collaborations

Soo Bin Jeong and Byung Kuk Kang are identified as Park’s coworkers. The available information does not specify their roles in the patent or whether they collaborated on it.

Conclusion

Hyuk Park’s recorded patent concerns a printed circuit board design that combines metal pads, passivation-layer openings, and insulating material.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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