Suwon, South Korea

Hyo Shin Lim

This inventor holds 1 USPTO granted patent. Top assignees: Samsung Electronics Co., Ltd., Semes Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hyo Shin Lim. Retrieved from https://idiyas.com/inventor/hyo-shin-lim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hyo Shin Lim: Semiconductor and Substrate-Cleaning Innovation.

Introduction

Hyo Shin Lim is an inventor associated with Suwon, South Korea. His patent work addresses substrate cleaning and semiconductor-package manufacturing, with an emphasis on integrating steam and gas delivery into a controlled apparatus.

Latest Patents

Lim is associated with 1 patent: “Apparatus of Cleaning Substrate, Apparatus of Semiconductor Device and Method for Manufacturing a Semiconductor Package Using the Same.” The invention describes a substrate-cleaning apparatus with a steam injector, a steam supplier, and a gas supplier. The injector includes a horizontally movable drive unit, a plate, and multiple nozzles arranged in one direction. Temperature and pressure sensors on the plate support monitoring, while the nozzles connect to both the steam and gas supplies. The disclosed apparatus is intended for substrate cleaning and semiconductor-package manufacturing.

Career Highlights

Lim’s listed company affiliations include Samsung Electronics Ltd. and SEMES Co., Ltd. His patent reflects work in semiconductor manufacturing equipment and processes, particularly substrate cleaning.

Collaborations

Lim’s listed coworker is Ho Jun Lee, who is identified in the supplied information as a woman. Their association connects the patent work with collaboration in the semiconductor technology field.

Conclusion

Hyo Shin Lim’s patent focuses on a sensor-equipped, multi-nozzle cleaning apparatus designed to support semiconductor substrate processing and package manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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