Hyeonseop Lee

Title: Hyeonseop Lee: Innovator in Mold Technology

Introduction

Hyeonseop Lee is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of mold technology, showcasing his innovative spirit through his patented inventions.

Latest Patents

Hyeonseop Lee holds a patent for a unique mold design. The mold includes a core in which a molded product is formed. The core comprises a cored body and a sliding core that is separable from the core body in a first direction. An ejector is integrated to press the sliding core in the first direction, facilitating the separation of the molded product from the core. The ejector features a driver positioned below the core, which is movable toward or away from the lower surface of the core. Additionally, a rod is included that can press the sliding core or couple it with the driver, enhancing the efficiency of the molding process. This innovative design has the potential to improve manufacturing processes significantly.

Career Highlights

Hyeonseop Lee is currently employed at Samsung Electronics Co., Ltd., where he continues to develop and refine his inventions. His work at this leading technology company allows him to collaborate with other talented professionals in the field.

Collaborations

Some of Hyeonseop Lee's coworkers include Changhwan Park and Jiyoon Kim. Their collaborative efforts contribute to the advancement of technology and innovation within their projects.

Conclusion

Hyeonseop Lee's contributions to mold technology exemplify his dedication to innovation and improvement in manufacturing processes. His patent reflects a deep understanding of engineering principles and a commitment to enhancing product design.