This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Hyeonmin Lee: Innovator in Semiconductor Technology
Introduction
Hyeonmin Lee is an inventor based in Suwon-si, South Korea. He is known for his contributions to semiconductor technology, focusing on innovative packaging solutions. Although he currently holds no granted patents, his work in the field is noteworthy.
Latest Patent Applications
Hyeonmin Lee's latest patent applications include a semiconductor package that features a first semiconductor chip, a dummy die on the first semiconductor chip, and second semiconductor chips stacked on the dummy die. This design incorporates through-electrodes in each component, enhancing connectivity. The application also describes a semiconductor chip that includes a first substrate with multiple pads and wiring patterns, ensuring efficient electrical connections. The innovative designs aim to improve the performance and reliability of semiconductor packages.
Conclusion
Hyeonmin Lee's work in semiconductor technology showcases his commitment to innovation, even as he seeks to secure patents for his groundbreaking ideas. His latest applications reflect a deep understanding of the complexities involved in semiconductor packaging.