Daegu, South Korea

Hyeonho Lee

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Industry-University Cooperation Foundation Hanyang University. Active years: 2026.

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hyeonho Lee: Innovator in Temperature-Responsive Surfaces

Introduction

Hyeonho Lee is a notable inventor based in Daegu, South Korea. He has made significant contributions to the field of temperature-responsive materials, particularly in the development of surfaces that can switch between hydrophilic and hydrophobic states based on temperature changes. His innovative work has implications for various applications, including heat exchangers.

Latest Patents

Hyeonho Lee holds a patent for a "Method for forming temperature-responsive hydrophilic-hydrophobic conversion surface, and temperature-responsive hydrophilic-hydrophobic conversion surface and heat exchanger, using same." This invention features a surface that remains hydrophobic at low temperatures and transitions to a hydrophilic state as the temperature increases. This unique property helps delay frost formation in low-temperature environments and facilitates the drying of meltwater during defrosting. The automatic conversion of the surface properties enhances heat transfer performance and power efficiency in heat exchangers.

Career Highlights

Hyeonho Lee is associated with the Industry-University Cooperation Foundation at Hanyang University. His work focuses on advancing materials science and engineering, particularly in the development of innovative solutions for thermal management.

Collaborations

Hyeonho Lee has collaborated with notable colleagues, including Dong Rip Kim and Jaehyeon Jeon. Their combined expertise contributes to the advancement of research in temperature-responsive materials.

Conclusion

Hyeonho Lee's innovative work in temperature-responsive surfaces showcases his commitment to enhancing heat exchange technologies. His contributions are paving the way for more efficient thermal management solutions in various industries.

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