Hyeonggyun Cheong

Title: Hyeonggyun Cheong: Innovator in Chip Bonding Technology

Introduction

Hyeonggyun Cheong is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of chip bonding technology, particularly through his innovative patent. His work is instrumental in advancing the efficiency and effectiveness of chip bonding processes.

Latest Patents

Hyeonggyun Cheong holds a patent for an "Apparatus for bonding chip band and method for bonding chip using the same." This invention features a chip bonding apparatus that includes a body, a substrate conveyor for transferring substrates, and a bonding head conveyor. The apparatus is equipped with an alignment unit that adjusts the positions of both the substrate and the chip. The bonding head, which is installed in the bonding head conveyor, is designed to attach a chip below it. The chip bonding unit consists of a body with an installation groove, a pushing module, and an attachment module with a deformable member. This innovative design allows for effective bonding of chips to substrates.

Career Highlights

Hyeonggyun Cheong is currently employed at Samsung Electronics Co., Ltd., where he continues to develop cutting-edge technologies in the semiconductor industry. His expertise in chip bonding has positioned him as a key player in the advancement of electronic manufacturing processes.

Collaborations

Hyeonggyun Cheong has collaborated with notable colleagues, including Euisun Choi and Huijae Kim. Their combined efforts contribute to the innovative environment at Samsung Electronics, fostering advancements in technology.

Conclusion

Hyeonggyun Cheong's contributions to chip bonding technology exemplify his commitment to innovation in the semiconductor field. His patent and ongoing work at Samsung Electronics Co., Ltd. highlight his role as a significant inventor in this industry.