Hyeon Jeong Hwang

Title: Hyeon Jeong Hwang: Semiconductor Packaging Innovations.

Introduction

Hyeon Jeong Hwang is an inventor based in Suwon, South Korea, whose patent work focuses on semiconductor packaging and manufacturing. He is associated with Samsung Electronics Ltd. and has 2 patents.

Latest Patents

Hwang’s recent patent work includes “Semiconductor package,” which describes an interposer with a recessed area containing a connection structure. Posts and lower and upper semiconductor chips are arranged to provide electrical connections through the interposer and connection structure. The design details how components can be integrated within a semiconductor package.

His other recent patent is “Method of marking semiconductor package.” It describes attaching a dry film to a package molding layer and using laser light to liquefy part of the film, forming an ink spot that solidifies into a marking pattern. The pattern can convey storage-capacity information or identify the product’s producer.

Career Highlights

The two described inventions address different stages of semiconductor production: package architecture and product marking. Together, they reflect Hwang’s contributions to packaging design and manufacturing processes at Samsung Electronics Ltd.

Collaborations

Hwang’s listed coworkers include Sangwon Lee and Geun Woo Kim. Their names are associated with his professional context, though the supplied information does not specify their roles in the patents.

Conclusion

Hyeon Jeong Hwang’s patent portfolio highlights innovations in semiconductor package structure and laser-assisted marking, connecting device integration with product identification.