Seoul, South Korea

Hyeok Park

USPTO Granted Patents = 1 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Hyeok Park: Innovator in Heat Dissipation Technology

Introduction

Hyeok Park is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of materials science, particularly in the development of heat dissipation technologies. His innovative work has led to the creation of a unique polymer composite material that addresses critical thermal management challenges.

Latest Patents

Hyeok Park holds a patent for a "High heat dissipation polymer composite material sheet and manufacturing method thereof." This patent outlines a method for manufacturing a heat dissipation film. The process involves preparing a first mixture by combining hexagonal boron nitride with an organic solvent, followed by primary surface modification of the hexagonal boron nitride. An amine-based silane compound is then added, leading to secondary surface modification. The method continues with the preparation of a second mixture that includes the secondarily surface-modified hexagonal boron nitride, an imidazole-based curing agent, and an organic solvent. The mixture is dispersed, and an epoxy resin is added before the final product is dried to create the heat dissipation film.

Career Highlights

Hyeok Park is currently employed at Samdo Ats Co., Ltd., where he continues to innovate in the field of heat management materials. His work has garnered attention for its potential applications in various industries, including electronics and automotive sectors.

Collaborations

Hyeok collaborates with talented individuals such as Taeyoon Lim and Hongsoo Kim, who contribute to the research and development efforts at Samdo Ats Co., Ltd. Their teamwork enhances the innovative capabilities of the company.

Conclusion

Hyeok Park's contributions to heat dissipation technology exemplify the importance of innovation in material science. His patented methods and collaborative efforts position him as a key figure in advancing thermal management solutions.

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