Chungju, South Korea

Hye Min Ahn

This inventor holds 1 USPTO granted patent. Top assignee: Yg-1 Co., Ltd. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hye Min Ahn. Retrieved from https://idiyas.com/inventor/hye-min-ahn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hye Min Ahn: Coated Cutting Tool Innovation

Introduction

Hye Min Ahn is an inventor associated with Chungju, South Korea, and YG-1 Co., Ltd. Her patent work concerns coatings designed to improve the durability and performance of cutting tools.

Latest Patents

Ahn is named on one patent, “Coated Cutting Tool and Method for Making Coating Layer.” The invention describes a coating formed on all or part of a cutting-tool substrate. It includes columnar-grain MT-TiCN and α-Al₂O₃ layers, with specified crystallographic texture characteristics. The MT-TiCN layer is deposited by chemical vapor deposition at temperatures from 800°C to 950°C, while the α-Al₂O₃ layer has a strong <001> orientation.

The disclosed approach aims to provide excellent wear resistance, chipping resistance, and adhesion. It achieves this without relying on the HT-TiCN layer used in some earlier approaches. Ahn’s listed patent portfolio comprises 1 patent.

Career Highlights

Ahn’s patent is associated with YG-1 Co., Ltd., a company known for cutting tools. The invention addresses coating composition and deposition methods, with the goal of improving tool performance under demanding machining conditions.

Collaborations

The patent lists Dong Seob Kim and Geun Woo Park as Ahn’s coworkers. Their shared work focuses on developing a coated cutting tool and a method for producing its coating layer.

Conclusion

Hye Min Ahn’s patent presents a coating-layer design intended to balance wear resistance, chipping resistance, and adhesion, contributing to cutting-tool innovation at YG-1 Co., Ltd.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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