Hwaseong-si, South Korea

Hwanpil Park

USPTO Granted Patents = 8 

Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2020-2025

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8 patents (USPTO):Explore Patents

Title: Hwanpil Park: Innovator in Semiconductor Technology

Introduction

Hwanpil Park is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of eight patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

Hwanpil Park's latest patents include innovative designs for semiconductor packages. One notable patent is for semiconductor packages having a dam structure. This design features a substrate with bonding pads, a lower semiconductor chip, and at least one upper semiconductor chip. The dam structure, which surrounds the lower semiconductor chip, includes both narrow and wide dams, optimizing the package's performance. Another significant patent is for a semiconductor package structure and its fabrication method. This method involves a base substrate, a die containing a semiconductor device, and solder bumps and balls that facilitate heat exhaust and signal transmission.

Career Highlights

Hwanpil Park is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to the company's innovative product offerings.

Collaborations

Hwanpil Park has collaborated with notable coworkers, including Youngho Kim and Dongho Kim. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor field.

Conclusion

Hwanpil Park's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His advancements continue to shape the future of semiconductor packaging and functionality.

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