logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10847435 B1

PDFFull Text
Date of Patent:
Nov. 24, 2020

Filed:

Aug. 30, 2016

Semiconductor package structure and fabrication method thereof

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Youngho Kim, Seoul, KR;

Hwanpil Park, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Marcos D Pizarro

Assistant Examiner:

Sue Tang

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/00 (2006.01); H01L 23/492 (2006.01); H01L 25/10 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 23/3677 (2013.01); H01L 23/3736 (2013.01); H01L 23/3738 (2013.01); H01L 23/40 (2013.01); H01L 23/492 (2013.01); H01L 24/19 (2013.01); H01L 25/105 (2013.01); H01L 23/49816 (2013.01); H01L 23/5389 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/19 (2013.01); H01L 2224/73259 (2013.01); H01L 2924/15153 (2013.01);
Abstract

A method of fabricating a semiconductor package structure is provided. The structure is configured to include a base substrate, a die disposed on the base substrate, the die including a semiconductor device, a solder bump disposed on a surface of the die, and configured to discharge heat generated in the die to an outside; and a solder ball disposed on another surface, opposite to the surface, of the die, and configured to transmit a signal, which is produced by the semiconductor device of the die, to an external device.

Find Patent Forward Citations

Kim, Youngho. (2020). Semiconductor package structure and fabrication method thereof (U.S. Patent No. 10847435). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10847435

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…