Hwan-Sik Lim

Title: Hwan-Sik Lim: Innovator in Semiconductor Technology

Introduction

Hwan-Sik Lim is a prominent inventor based in Gunpo-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of seven patents. His work focuses on innovative solutions that enhance the functionality and efficiency of multi-chip packages.

Latest Patents

Among his latest patents is a design for bump structures having an extension. This invention includes a body portion that is spaced apart from a pad on a substrate, featuring a first extension that extends from the body portion onto the pad. Additionally, a second extension extends from another side of the body portion. Another notable patent is for a multi-chip package and its manufacturing method. This package comprises first and second semiconductor chips, an insulating layer structure, and a plug structure. The first semiconductor chip includes a bonding pad, while the second chip is positioned above it, also featuring a bonding pad. The insulating layer structure covers the side surfaces and portions of the upper surfaces of the chips, and the plug structure connects the bonding pads through a plating process, eliminating the need for a micro bump formation between the plugs.

Career Highlights

Hwan-Sik Lim is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in multi-chip packaging.

Collaborations

He has collaborated with notable colleagues, including Jongho Lee and Sun-Hee Park, who have also contributed to the innovative projects at Samsung.

Conclusion

Hwan-Sik Lim's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the field. His inventions continue to influence the development of advanced electronic components.