The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2013
Filed:
Mar. 31, 2011
Applicants:
Sun-won Kang, Seongnam-si, KR;
Hwan-sik Lim, Gunpo-si, KR;
Inventors:
Sun-won Kang, Seongnam-si, KR;
Hwan-sik Lim, Gunpo-si, KR;
Assignee:
Samsung Electronics Co., Ltd, Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/788 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor chip includes a redistribution interconnect that is implemented by shorting bumps, and a semiconductor package and a system each including the semiconductor chip. The semiconductor chip includes a semiconductor substrate, a passivation film disposed on the semiconductor substrate, and a plurality of pseudo bumps disposed on the passivation film. Each pseudo bump is directly connected to adjacent pseudo bumps to form at least one redistribution interconnect.