Hungen Hsu

Title: Hungen Hsu: Innovator in Semiconductor Packaging

Introduction

Hungen Hsu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and methods.

Latest Patents

Hungen Hsu holds a patent for a "Package substrate, package using the same, and method of manufacturing the same." This invention provides a package substrate that includes a substrate with a cavity hole, housing a semiconductor device. The semiconductor device features a first terminal side and a second terminal side, with a first redistribution structure on the first terminal side and a second redistribution structure on the opposite side. This design allows for efficient electrical coupling to various pads on the semiconductor device.

Career Highlights

Hungen Hsu is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work has been instrumental in advancing packaging technologies that enhance the performance and reliability of semiconductor devices.

Collaborations

Hungen has collaborated with notable colleagues, including Wei-Tien Shen and Kuo-Ching Hsu, contributing to various projects that push the boundaries of semiconductor technology.

Conclusion

Hungen Hsu's innovative work in semiconductor packaging exemplifies his commitment to advancing technology in the field. His contributions, particularly through his patent, highlight the importance of innovation in enhancing semiconductor performance.