This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Texas Instruments Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations of Inventor Hung-Yu Chou
Introduction
Hung-Yu Chou is a notable inventor based in Dallas, TX (US). He has made significant contributions to the field of technology, particularly in the area of packaging for electronic devices. His innovative approach has led to the development of a unique patent that enhances the functionality and efficiency of electronic components.
Latest Patents
Hung-Yu Chou holds a patent for "Packages with multiple exposed pads." This invention involves an apparatus that comprises a lead frame with a first row of leads and a first pad coupled to this row. Additionally, there is a second row of leads parallel to the first, along with a second pad coupled to the second row. The design features a gap between the first and second pads, both of which maintain a substantially uniform thickness. This apparatus also includes a device connected to the first and second pads, which are exposed to the exterior of the apparatus. This innovative design improves the accessibility and performance of electronic devices.
Career Highlights
Hung-Yu Chou is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His work at Texas Instruments has allowed him to collaborate with other talented professionals and contribute to groundbreaking advancements in technology.
Collaborations
Some of his notable coworkers include Bo-Hsun Pan and Yuh-Harng Chien. Their collaborative efforts have further enhanced the innovative projects at Texas Instruments Corporation.
Conclusion
Hung-Yu Chou's contributions to the field of technology through his patent and work at Texas Instruments Corporation exemplify the spirit of innovation. His inventions continue to influence the development of electronic packaging solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
