Taipei, Taiwan

Hung-Wei Hsu


Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 33(Granted Patents)


Company Filing History:


Years Active: 2016-2018

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5 patents (USPTO):Explore Patents

Title: Innovations by Inventor Hung-Wei Hsu

Introduction

Hung-Wei Hsu is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of high-speed connectors and communication technology. With a total of five patents to his name, Hsu continues to push the boundaries of innovation in his industry.

Latest Patents

Among his latest patents is a high-speed connector and connector assembly. This invention features an insulating body, an insulating cap, two terminal sets, and two shielding sheets. The design includes a tongue plate that divides the interior of the body portion into two accommodating spaces. Each terminal set comprises a terminal base and multiple terminals, with shielding sheets providing ground shielding to enhance performance. Another notable patent is a high-frequency signal communication connector with improved crosstalk performance. This connector includes an insulated housing, first and second terminals, a conductive shielding layer, and a metal shell. The design aims to reduce crosstalk interference, ensuring better shielding effectiveness.

Career Highlights

Hung-Wei Hsu is currently employed at Nextronics Engineering Corporation, where he applies his expertise in developing advanced connector technologies. His work has been instrumental in enhancing the performance and reliability of communication systems.

Collaborations

Hsu collaborates with talented individuals such as Hou-An Su and Chi-Jung Chan, contributing to a dynamic team focused on innovation and excellence in engineering.

Conclusion

Hung-Wei Hsu's contributions to the field of high-speed connectors and communication technology exemplify his commitment to innovation. His patents reflect a deep understanding of engineering principles and a drive to improve technology for better performance.

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