Highland Mills, NY, United States of America

Hung The Hac Nguyen

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hung The Hac Nguyen. Retrieved from https://idiyas.com/inventor/hung-the-hac-nguyen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations by Hung The Hac Nguyen

Introduction

Hung The Hac Nguyen is an accomplished inventor based in Highland Mills, NY (US). He has made significant contributions to the field of printed circuit board (PCB) technology. His innovative work focuses on optimizing vertical conductive structures, which enhances the performance of PCBs.

Latest Patents

Hung The Hac Nguyen holds a patent for "Vertical conductive structure transition impedance optimization." This invention involves a printed circuit board (PCB) that features vertical conductive structures (VeCSs). The VeCS includes a slot defined in a dielectric substrate, where a vertical signal trace is positioned on one side and a vertical reference trace on the opposite side. The design ensures a predetermined impedance, with multiple signal ground planes positioned at specific distances from the vertical signal trace. This innovative approach improves the efficiency and reliability of PCBs.

Career Highlights

Hung The Hac Nguyen is associated with International Business Machines Corporation (IBM), where he applies his expertise in PCB technology. His work at IBM has allowed him to contribute to advancements in electronic design and manufacturing processes.

Conclusion

Hung The Hac Nguyen's innovative patent and contributions to PCB technology highlight his role as a significant inventor in the field. His work continues to influence the development of more efficient electronic systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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