Hung-Shung Ko

Title: Innovations of Hung-Shung Ko in Semiconductor Packaging

Introduction

Hung-Shung Ko is a notable inventor based in Hemei, Taiwan. He has made significant contributions to the field of semiconductor packaging. His innovative methods have paved the way for advancements in the industry.

Latest Patents

Hung-Shung Ko holds a patent for a "Method for preparing a semiconductor package." This patent outlines a process for creating a semiconductor package that meets standard size requirements from a die that is smaller than the standard size. The method involves providing a wafer, forming a die on the wafer, dicing the die, encapsulating it, and singulating the encapsulated die to achieve a size equal to or larger than the standard size 0201. This innovation is crucial for enhancing the efficiency and effectiveness of semiconductor packaging.

Career Highlights

Hung-Shung Ko is currently associated with Inpaq Technology Co., Ltd. His work at this company has allowed him to focus on developing cutting-edge technologies in semiconductor packaging. His expertise and innovative mindset have contributed to the company's reputation in the industry.

Collaborations

Hung-Shung Ko has collaborated with talented individuals such as Yu-Ming Peng and Chu-Chun Hsu. These collaborations have fostered a creative environment that encourages the development of new ideas and technologies.

Conclusion

Hung-Shung Ko's contributions to semiconductor packaging through his innovative methods and collaborations highlight his importance in the field. His work continues to influence advancements in technology and the semiconductor industry.