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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10468378 B1

PDFFull Text
Date of Patent:
Nov. 05, 2019

Filed:

Jul. 26, 2017

Method for preparing a semiconductor package

Applicant:

Inpaq Technology Co., Ltd., Miaoli, TW;

Inventors:

Yu-Ming Peng, Taichung, TW;

Chu-Chun Hsu, Toufen Township, Miaoli County, TW;

Hung-Shung Ko, Hemei Township, Changchua County, TW;

Hsiu-Lun Yeh, Pingzhen, TW;

Assignee:

INPAQ TECHNOLOGY CO., LTD., Miaoli, TW;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Latanya N Crawford

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 23/498 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); H01L 21/78 (2013.01); H01L 23/293 (2013.01); H01L 23/3121 (2013.01); H01L 23/49838 (2013.01); H01L 21/4867 (2013.01); H01L 21/561 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01);
Abstract

The present disclosure provides a method for preparing a semiconductor package having a standard size from a die having a size smaller than the standard size. The method includes: providing a wafer; forming a die on the wafer, wherein the die has a size smaller than one-half of a standard size 0201; dicing the die from the wafer; encapsulating the die to form an encapsulated die; and singulating the encapsulated die to form a semiconductor package having a size equal to or larger than the standard size 0201.

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