Company Filing History:
Years Active: 2016-2018
Title: Innovations by Inventor Hung Min Chen
Introduction
Hung Min Chen is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of printed circuit board manufacturing. With a total of 2 patents, his work focuses on innovative methods that enhance the efficiency and accuracy of electronic component integration.
Latest Patents
One of Hung Min Chen's latest patents is a method of manufacturing printed circuit boards with embedded electronic components positioned using solder paste. This method involves providing a carrier board with a copper foil layer and an insulating layer, followed by creating an opening in the insulating layer using laser technology. The process includes placing solder paste into the opening, performing a high-temperature reflow process, and curing the solder paste layer to fix the components accurately. This innovative approach eliminates position offsets during installation, ensuring precise placement of electronic components.
Another significant patent by Hung Min Chen is a method for directly attaching dielectric to circuit boards with embedded electronic devices. This method produces a plurality of through holes that correspond to the electrodes of the electronic device. By embedding the electronic device accurately, the first dielectric layer, which is adhesive, allows for direct attachment, thereby reducing costs associated with adhesive materials or metal conductive pastes used in prior arts.
Career Highlights
Hung Min Chen is currently employed at Unitech Printed Circuit Board Corporation, where he continues to develop and refine his innovative techniques in printed circuit board manufacturing. His work has been instrumental in advancing the technology used in the industry.
Collaborations
He collaborates with talented coworkers, including Ming Yi Yeh and Shun Yueh Hsu, who contribute to the innovative projects at Unitech Printed Circuit Board Corporation.
Conclusion
Hung Min Chen's contributions to the field of printed circuit board manufacturing demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in electronic component integration, paving the way for future advancements in the industry.