Company Filing History:
Years Active: 2020-2025
Title: Innovations of Inventor Hung-Chun Cho
Introduction
Hung-Chun Cho is a prominent inventor based in Hsinchu, Taiwan, renowned for his contributions to the field of semiconductor technology. With a remarkable portfolio of 14 patents, Cho has significantly impacted how semiconductor packaging is designed and functions.
Latest Patents
Cho's latest inventions include innovative patent submissions that enhance semiconductor package structures. One of his notable patents describes a package structure that incorporates an auxiliary dielectric portion. This design facilitates enhanced connectivity between the semiconductor die and redistribution layers, ultimately improving signal integrity and manufacturing efficiency. Another significant achievement is the semiconductor package and method of forming the same, which details a design featuring a conductive pillar and a unique complex compound sheath, enabling robust electrical connections and efficiency in thermal management.
Career Highlights
Hung-Chun Cho's career has been marked by his role at Taiwan Semiconductor Manufacturing Company Limited (TSMC), where he plays an important part in developing advanced semiconductor technologies. His numerous patents reflect his expertise and innovations in enhancing semiconductor device performance. Throughout his career, Cho has garnered respect and recognition for pushing the boundaries of semiconductor technology.
Collaborations
In his innovative journey, Cho has collaborated with other talented professionals, including Hung-Jui Kuo and Yu-Hsiang Hu. These collaborations have fostered a creative environment that has led to several groundbreaking advancements in semiconductor design and packaging.
Conclusion
As an inventor, Hung-Chun Cho continues to pave the way for innovation in semiconductor technology through his significant patents and valuable collaborations. His work at TSMC not only enriches his career but also contributes to the advancement of the industry as a whole. Cho's ongoing innovations are sure to influence future developments in semiconductor packaging and technology.