Hung-Chou Yang

Title: Innovations of Hung-Chou Yang

Introduction

Hung-Chou Yang is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to chip packaging.

Latest Patents

His latest patents include a semiconductor chip package structure designed to achieve flip-chip type electrical connections without the use of a wire-bonding process. This innovative package structure consists of a package unit, a semiconductor chip, a first insulative layer, first conductive layers, a second insulative layer, and second conductive layers. The package unit features a receiving groove where the semiconductor chip is housed, equipped with multiple conductive pads on its top surface. The first insulative layer is strategically placed between the conductive pads to provide insulation. The first conductive layers are formed on both the first insulative layer and the package unit, with one side of each layer connected to the corresponding conductive pad. Additionally, the second insulative layer is positioned between the first conductive layers to ensure they remain insulated from one another. The second conductive layers are then formed on the opposite sides of the first conductive layers, completing the innovative design.

Career Highlights

Hung-Chou Yang is currently employed at Harvatek Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the efficiency and effectiveness of chip packaging solutions.

Collaborations

He collaborates with talented coworkers, including Bily Wang and Jeng-Ru Chang, who contribute to the innovative environment at Harvatek Corporation.

Conclusion

Hung-Chou Yang's contributions to semiconductor technology through his patents reflect his dedication to innovation in the field. His work continues to influence the industry and pave the way for future advancements.