Hung-Cheng Chen

Title: Innovations of Hung-Cheng Chen in High-Power Module Fabrication

Introduction

Hung-Cheng Chen is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of high-power module fabrication. His innovative approach utilizes advanced materials and techniques to enhance the performance and stability of electronic components.

Latest Patents

Hung-Cheng Chen holds a patent for a "Method of fabricating high-power module." This method involves using a non-touching needle to apply a slurry containing nano-silver and micron silver particles onto a heat-dissipation substrate. The specific ratio of these silver particles is maintained between 9:1 and 1:1. The substrate is then heated to a specific temperature, and an integrated chip (IC) is placed above it to form a combined piece. A hot presser is used to apply thermocompression, creating a thermal-interface-material (TIM) layer that integrates the IC and substrate. After heat treatment, the TIM achieves over 99 percent purity in silver, minimizing organic matter and ensuring stability under high temperatures. This innovative method eliminates the risk of embrittlement due to procedural temperatures.

Career Highlights

Hung-Cheng Chen is affiliated with National Cheng-Kung University, where he continues to advance research in high-power modules. His work has garnered attention for its practical applications in electronics and thermal management.

Collaborations

He has collaborated with notable colleagues, including Chang-Shu Kuo and In-Gann Chen, to further enhance the research and development of high-power modules.

Conclusion

Hung-Cheng Chen's contributions to the field of high-power module fabrication demonstrate his innovative spirit and commitment to advancing technology. His patented methods are paving the way for more efficient and stable electronic components.