This inventor holds 1 USPTO granted patent. Top assignee: Yangtze University. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Huiyong Zeng: Innovator in Plugging Materials
Introduction
Huiyong Zeng is a notable inventor based in Jingzhou, China. He has made significant contributions to the field of materials science, particularly in the development of innovative plugging materials. His work is characterized by a focus on high-performance materials that can withstand extreme conditions.
Latest Patents
Huiyong Zeng holds a patent for a plugging material, which is prepared using a specific combination of raw materials. The formulation includes 1 to 3.6 parts of PETA-modified bisphenol A epoxy resin, 1.5 to 2.4 parts of an addition product of m-phenylenediamine and methacrylic acid, and 0.12 to 0.17 parts of nanosilica dispersion liquid, with water making up the remainder. The preparation method involves creating a gel-forming liquid through a continuous stirring process and then mixing it with dibenzoyl peroxide at controlled temperatures. This innovative plugging material is designed to be resistant to high temperatures and high salinity, showcasing strong plugging performance.
Career Highlights
Huiyong Zeng is affiliated with Yangtze University, where he continues to advance his research and development efforts. His work has garnered attention for its practical applications in various industries, particularly those requiring robust materials.
Collaborations
Huiyong Zeng collaborates with esteemed colleagues, including Lifeng Chen and Jiamin Zhang. Their combined expertise contributes to the advancement of innovative solutions in materials science.
Conclusion
Huiyong Zeng's contributions to the field of plugging materials exemplify the importance of innovation in addressing complex challenges. His patented work not only highlights his expertise but also underscores the potential for future advancements in material technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile