Seattle, WA, United States of America

Huilin Lu

This inventor holds 1 USPTO granted patent. Top assignee: Amazon Technologies, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Huilin Lu. Retrieved from https://idiyas.com/inventor/huilin-lu-wvwiniuj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Huilin Lu and Enhanced Prompt Reasoning for Machine Learning Models.

Introduction

Huilin Lu is an inventor based in Seattle, Washington, whose patent work addresses prompt engineering for language models. The provided information lists 1 patent and identifies Amazon Technologies, Inc. as his company.

Latest Patents

Lu’s patent, “Enhanced Prompt Reasoning at Application Layer for Machine Learning Models,” describes devices, systems, and methods for structuring language-model prompts. The method first provides a prompt asking a language model to generate task-specific reasoning modules. It then supplies another prompt containing the original task, a second task, and one of those modules, instructing the model to create an initial reasoning structure for responding to the original task without yet providing the response.

Career Highlights

The supplied information associates Lu with Amazon Technologies, Inc. and identifies his invention as focused on application-layer techniques for guiding language-model reasoning. The patent describes a staged process that generates reasoning modules and uses them to shape a preliminary response structure.

Collaborations

Krishna Aswani and Pranav Shirish Patankar are listed as Lu’s coworkers. The provided details do not specify their roles in the patent or whether they collaborated on the invention.

Conclusion

Huilin Lu’s listed patent presents a structured approach to prompt engineering that separates the creation of task-specific reasoning modules from the development of an initial reasoning structure.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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