Hong Kong, China

Huihe Qiu

This inventor holds 1 USPTO granted patent. Top assignee: The Hong Kong University of Science and Technology. Active years: 2017.


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Innovations of Huihe Qiu in Electronic Device Cooling

Introduction

Huihe Qiu is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electronic device cooling through his innovative patent. His work focuses on enhancing the efficiency of heat dissipation in electronic devices, which is crucial for their performance and longevity.

Latest Patents

Huihe Qiu holds a patent for a "Phase-change chamber with patterned regions of high and low affinity to a phase-change medium for electronic device cooling." This invention involves a phase-change chamber that includes a phase-change medium capable of transitioning between multiple phases. The design features a first surface that transitions a portion of the phase-change medium from a first phase into a second phase, and a second surface that transitions it back. The chamber is designed with regions of high and low affinity to the phase-change medium, optimizing the cooling process for electronic devices.

Career Highlights

Huihe Qiu is affiliated with The Hong Kong University of Science and Technology, where he continues to advance research in the field of electronic cooling technologies. His innovative approach to phase-change materials has positioned him as a key figure in this area of study.

Collaborations

Huihe Qiu has collaborated with notable colleagues such as Zhen Sun and Xiaodan Chen. Their combined expertise contributes to the advancement of research and development in electronic device cooling solutions.

Conclusion

Huihe Qiu's contributions to the field of electronic device cooling through his innovative patent demonstrate his commitment to enhancing technology. His work not only improves device performance but also paves the way for future advancements in cooling technologies.

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