This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Beijing Smartchip Microelectronics Technology Comp. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Huifeng Bai and Model Compression for Power-System Topology Recognition.
Introduction
Huifeng Bai is an inventor based in Beijing, China. His patent work includes a method for compressing topology recognition models for use in Internet of Things terminals in power systems.
Latest Patents
Bai is associated with one patent: “Method and Apparatus for Compressing Topology Recognition Model, Electronic Device, and Medium.” The invention describes repeatedly pruning and training a neural network model, then reducing the bit quantity of its weight parameters and training it again. These steps are repeated until a compressed topology recognition model is produced for deployment on an Internet of Things in Power Systems (IOTIPS) terminal. The approach is intended to reduce the model’s size.
Career Highlights
Bai works at Beijing Smartchip Microelectronics Technology Co. His patent focuses on making topology recognition models more compact for deployment in power-system IoT devices.
Collaborations
Bai’s listed coworkers include Jianan Yuan and Chao Huo.
Conclusion
Huifeng Bai’s patent addresses the practical challenge of reducing topology recognition model size through iterative pruning and quantization, supporting deployment on power-system IoT terminals.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile