Shanghai, China

Hui Zong

This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: 3M Innovative Properties Company. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hui Zong. Retrieved from https://idiyas.com/inventor/hui-zong-u4jera5m

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Hui Zong - Innovator in Adhesive Technologies

Introduction

Hui Zong is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of adhesive technologies, particularly through his innovative patent work. His expertise lies in developing advanced adhesive compositions that cater to various industrial applications.

Latest Patents

Hui Zong holds a patent for a pressure-sensitive adhesive composition, conductive adhesive composition, and adhesive tape made therefrom. This invention provides a thermally curable pressure-sensitive adhesive composition that includes a reactive polymethacrylate component and a benzoxazine component. The composition is designed for use in membranes for electronic and electrical products, automotive products, and new energy equipment.

Career Highlights

Hui Zong is associated with 3M Innovative Properties Company, where he has been instrumental in advancing adhesive technologies. His work has led to the development of products that enhance the performance and reliability of various applications.

Collaborations

Hui Zong has collaborated with notable colleagues, including Qing Wu and Jing Fang, to further innovate in the field of adhesives. Their combined expertise has contributed to the success of their projects and patents.

Conclusion

Hui Zong's contributions to adhesive technology demonstrate his commitment to innovation and excellence in his field. His work continues to impact various industries, showcasing the importance of advanced adhesive solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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