Daejeon, South Korea

Hui-Yun Hwang

This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Korea Advanced Institute of Science and Technology. Active years: 2005-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hui-Yun Hwang. Retrieved from https://idiyas.com/inventor/hui-yun-hwang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile



Average Co-Inventor Count = 5.8

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2005-2009

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2 patents (USPTO):Explore Patents

Title: Innovations of Hui-Yun Hwang

Introduction

Hui-Yun Hwang is a notable inventor based in Daejeon, South Korea. He has made significant contributions to the field of engineering, particularly in the development of advanced materials and methods for monitoring structural integrity. With a total of 2 patents, Hwang's work reflects a commitment to enhancing the reliability and performance of engineering applications.

Latest Patents

Hwang's latest patents include a nondestructive reliability monitoring method for adhesively bonded structures. This innovative method improves sensitivity by utilizing piezoelectric or conductive materials. The process involves mixing a piezoelectric or electrically conductive material with an adhesive agent, curing it between bonding target objects, and measuring electric charges to assess bonding integrity and predict the remaining lifespan of the structures.

Another significant invention is a high stiffness composition tool bar. This machining tool bar enhances mechanical machining properties by employing high stiffness composite materials. The design includes an adaptor for coupling to a driving device, a body for mounting cutting tools, and a tip supported by a workpiece. The combination of metal and composite materials ensures improved performance and durability.

Career Highlights

Hui-Yun Hwang is affiliated with the Korea Advanced Institute of Science and Technology, where he continues to advance his research and innovations. His work has garnered attention for its practical applications in various engineering fields.

Collaborations

Hwang has collaborated with esteemed colleagues such as Dai-Gil Lee and Jae-Wook Kwon. These partnerships have contributed to the development of his innovative patents and have fostered a collaborative research environment.

Conclusion

Hui-Yun Hwang's contributions to engineering through his patents demonstrate his innovative spirit and dedication to improving technology. His work not only enhances the reliability of bonded structures but also advances the capabilities of machining tools.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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