Warren, MI, United States of America

Hui-Ping Wang


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Hui-Ping Wang: Innovator in Finite Element Analysis

Introduction

Hui-Ping Wang is a notable inventor based in Warren, MI (US). He has made significant contributions to the field of engineering, particularly in the area of finite element analysis (FEA). His innovative approach has led to advancements that enhance the efficiency of simulations in various modeled systems.

Latest Patents

Hui-Ping Wang holds a patent for "Adaptive time scaling for accelerating explicit finite element analysis." This method accelerates an explicit finite element analysis simulation by performing an initial iteration according to a baseline time interval. The process involves calculating a criteria ratio of a predetermined set of scaling criteria and determining a time-scaling factor based on this ratio. The scaled time interval generated from this factor significantly reduces simulation time, allowing for more efficient iterations in the FEA simulation.

Career Highlights

Throughout his career, Hui-Ping Wang has worked with prominent organizations such as GM Global Technology Operations LLC and UT-Battelle, Inc. His experience in these companies has allowed him to apply his innovative methods in real-world applications, contributing to advancements in technology and engineering.

Collaborations

Hui-Ping Wang has collaborated with talented individuals in his field, including Jian Chen and Hui Huang. These collaborations have fostered an environment of innovation and have led to the development of cutting-edge solutions in finite element analysis.

Conclusion

Hui-Ping Wang's contributions to the field of finite element analysis exemplify the impact of innovative thinking in engineering. His patented methods not only enhance simulation efficiency but also pave the way for future advancements in the industry.

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