Company Filing History:
Years Active: 2022-2025
Title: Hui-Ping Jian: Innovator in Semiconductor Technology
Introduction
Hui-Ping Jian is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing electronic devices and semiconductor packaging.
Latest Patents
Hui-Ping Jian's latest patents include an electronic device and a method of manufacturing the same. This electronic device features a carrier with a first surface and a first lateral surface, an antenna adjacent to the first surface, and a shielding layer that covers part of the first lateral surface. The shielding layer is designed to ensure that the antenna's gain exceeds 20 dB. Another patent involves a semiconductor device package that includes conductive layers as shielding and a method for its manufacturing. This package consists of a substrate, a conductive element, and conductive layers, with varying numbers of layers on different portions of the conductive layers.
Career Highlights
Hui-Ping Jian is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of electronic devices and semiconductor packages.
Collaborations
Hui-Ping Jian has collaborated with notable colleagues, including Ming-Hung Chen and Jia-Feng Ho, contributing to various projects within the semiconductor field.
Conclusion
Hui-Ping Jian's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to impact the development of advanced electronic devices.